ABOUT 3DIT-MSP&DL

The 3D IT-MSP&DL2020 aims to provide a forum that brings together researchers and academia as well as practitioners from industry to meet and exchange their ideas and recent research development work on all aspects of Images, their applications and other related areas. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. A key aspect of this conference is the strong mixture of academia and industry. 

This conference brings the experts, practitioners, scientists and decision-makers from academia and industry together. Our aim is to foster a strong, lively and well-connected international research community. We welcome innovative ideas, concepts, services, techniques, research outputs and business practices. 

This conference brings the experts, practitioners, scientists and decision-makers from academia and industry together. Our aim is to foster a strong, lively and well-connected international research community. We welcome innovative ideas, concepts, services, techniques, research outputs and business practices.


Conference History

IC3DIT2019 (The 1st edition of 3D IT-MSP&DL) was successfully held on August 15-18, 2019 in Kunming, and all of the accepted papers had been published by Springer and submitted to ISI Proceedings, EI-Compendex, SCOPUS, Google Scholar and Springerlink for indexing. 

More details about IC3DIT2019:www.s3diconference.com/2019/menu/home




Publication

Proceeding

3DIT-MSP&DL will be published in Smart Innovation, Systems and Technologies(ISSN: 2190-3018)by Springer-Verlag. More information on publication is included in anthor’s guide--publication of this website. The proceeding of 3DIT-MSP&DL is submitted to ISI Proceedings, EI-Compendex, DBLP, SCOPUS, Google Scholar and Springerlink. Currently, the retrieval of papers from the history conference which are submitted by Springer-Verlag is normal.


Journals

Some of the best papers of 3DIT-MSP&DL will have the chances to be recommended to SCI / EI journals for publishing, In such case, the papers must be significantly changed after improvement and expanding - usually, at least 30% changes are requested.


Collaborating journals

We will work with a number of high quality and indexed journals (SCI, SSCI, EI, ESCI, ABS, Scopus) including:
(1). Enterprise Information Systems (Indexed: SCI/EI/Scopus/Inspec)
(2). International Journal of Computational Intelligence Systems (Indexed: SCI/EI/Scopus/Inspec)
(3). International Journal of Information and Communication Technology (Indexed: EI/Scopus/Inspec)
(4). International Journal of Information Systems and Supply Chain Management (Indexed: EI/Scopus/Web of Science ESCI/Inspec)
(5). International Journal of Information Systems in the Service Sector (Indexed: EI/Scopus/Web of Science ESCI/Inspec)
(6). International Journal of Grid and Utility Computing (Indexed: EI/Scopus/Inspec)
(7). International Journal of Applied Decision Sciences (Indexed: EI/Scopus/Inspec)
(8). International Journal of Enterprise Information Systems (Indexed: EI/Scopus/Web of Science ESCI/Inspec)
(9). Symmetry-SI-Multidimensional Signal Processing and Its Applications (Indexed: SCI/Scopus/Web of Science/Inspec)



Co-organizers